Kontron KBox B-202-CFL: Kompaktes, Ultra-Leises Embedded PC mit 8. Gen Intel Power
Kontron, a Global Leader in Industrial Computing, Has Expanded Its Embedded Box PCs Portfolio With the KBox B-202-CFL. Built on 8th-Generation Intel Core i3/i5/i7 Processors und the Intel® Q370 Express Chipset, the Unit Delivers Uncompromised Performance While Keeping Noise to a Maximum of 34 dB(A). Its Modular Design Allows Installation of Either Two PCIe x8 Cards or a Single PCIe x16 Slot, Making It an Ideal Platform für Demanding Workloads Such as High-End Image Processing, SCADA/MES, Artificial Intelligence und Machine Learning.
Compliance und Design
Compliance Is Not an Afterthought: the KBox B-202-CFL Carries the EN55032 Class B Certification, Guaranteeing Reduced RFI Emissions und Suitability für Industrial, Commercial, und Residential Environments. The Sleek, Compact Chassis Is Tailored für Architecture Studios, Graphic Design Workstations, und Music Production Suites.
Motherboard und CPU
The Heart of the System Is a 170 × 170 mm Mini-ITX Motherboard That Supports Up to Six CPU Cores. Users Can Choose Between the 8th-Generation Intel Core i3, i5, oder i7, Ensuring Flexibility für a Range of Applications.
Storage und Video
Storage Options Are Equally Versatile. A 2.5-Inch SSD Can Be Paired With an M.2 SSD, or a Dual-M.2 RAID Configuration Can Be Deployed. On-Request Expansions Allow Up to Four Mass-Storage Devices. Video Output Is Handled by Two DisplayPort V1.2 Connectors und a DVI-D Port, While Connectivity Is Amplified by Four USB 2.0, Four USB 3.1 Gen 1, Two USB 3.1 Gen 2, und a Serial COM1/RS232 Port. Dual 10/100/1000 Mbit/s Ethernet Ports Support Wake-on-LAN für Remote Management.
Extras
An Optional DVD-ROM Drive Is Available, und the System Ships With Windows 10 IoT Ready. The Enclosure – Measuring 190 × 120 × 190 mm – Combines Hot-Dip Galvanised Steel (EN10215) mit Aluminium, Providing a Durable Yet Lightweight Frame. An Almost Silent Fan Keeps the Unit Cool in the 0 °C to +45 °C Operating Range.
Eingebettet
- Synopsys präsentiert vollständiges HBM3 IP-Paket für Multi-Die-Systeme mit 921 GB/s Bandbreite
- MAXREFDES220# – Manschettenlose Blutdruckmessung mit optischen Sensoren
- Bluetooth 5.1 SoC: Ultra-kompakte, kostengünstige Lösung für IoT-Geräte
- Kontron launcht COM Express Type 6 Module powered by 8. Gen Intel Core & Celeron CPUs
- Kontron COMe-bCL6: 9. Gen Intel CPUs & 128 GB DDR4 – Industrieller Rugged Computing für Edge & Server
- emtrion bringt kompaktes emCON-MX8M Mini Modul mit NXP i.MX 8M Mini
- Geschlechtersensible, individuelle Fahrradsättel mit Formlabs Fuse 1 SLS-Drucker erstellen
- Design & Produktion beschleunigen mit Formlabs und Fusion 360 Integration
- Luft- und Dampfhämmer erklärt: Typen, Aufbau und Funktionsweise
- MS52 CNC Stangen-/Futtermaschine: Offenes Frontdesign für Hochvolumenproduktion