TI stellt BAW Resonator Chips vor: Revolution für Next-Gen Connectivity

Texas Instruments (TI) hat neue Line Bulk Acoustic Wave (BAW)-basierter Embedded Processors und Analog ICs Enthüllt – Set To Transform Next Generation Connectivity und Communications Infrastructure.

First Two BAW Products

• SimpleLink CC2652RB Wireless Mikrocontroller
• LMK05318 Network Synchronizer Clock

Both Designed To Simplify System Integration, Accelerate Time-to-Market, Deliver High-Performance, Low-Cost Data Transport.

Elimination External Crystals

Traditional Communication/Industrial Automation Solutions Rely on Discrete Quartz-Crystal Oscillators – Expensive, Bulky, Vulnerable to Temperature Fluctuations, Vibration, Shock. By Embedding High-Frequency BAW Resonators Directly Into QFN Package, TIs New Devices Eliminate Need External Crystals – Resulting Smaller Footprint, Superior Stability, Greater Resilience to Mechanical Stress.

CC2652RB: Industry's First Crystal-Less Wireless MCU

Incorporates BAW Resonator Replacing External 48 MHz Crystal – Still Supporting Zigbee, Thread, Bluetooth LE, Proprietary 2,4-GHz Protocols. Wide Operating Temp Range -40 °C bis +85 °C – Designers Flexibility Across Harsh Environments.

LMK05318: Ultra-Low-Jitter Clock für 400-Gbps Links

Provides Single-Channel Ultra-Low-Jitter Clock für 400-Gbps Links. Hitless Switching Performance und Exceptional Jitter Margins Give System Architects Reliable Foundation für 56-Gbps und Emerging 112-Gbps PAM-4 Interfaces – Reducing Bit-Error Rates, Boosting Overall Network Throughput.

Because LMK05318 Requires No In-System Programming, Has Simplified Power-Supply Needs, Cuts Ancillary Components – Streamlines PCB Layout, Lowers BOM Cost vs. Competing Solutions.

By Integrating BAW Resonator Technology, TI Delivers Robust, Compact, Cost-Effective Components Enabling Faster Data Delivery und More Reliable Communication Across Wired und Wireless Networks.