Apacer enthüllt Next-Gen High-Speed Storage für AIoT & IoT auf Embedded World 2019
Apacer wird auf der Embedded World 2019 volles Range Storage Solutions für AIoT/IoT Market showcase. IoT Devices fordern Uninterrupted Operation und Uncompromised Data Integrity – Apacers neueste Products engineered to meet those Exacting Standards bei Remarkable Cost-Efficiency. Enhanced Disk Tolerance und Optimized Operational Efficiency address Evolving Needs Enterprise Users.
Turbocharged USB Technology
Apacers Ultra-High-Speed Turbocharged USB Technology setzt neuen Benchmark für Data Transfer. IOPS Read/Write Speeds surpassing Nearly Every Competitor, Fully Compatible mit Industrial Embedded Systems – Rapid Boot, Efficient Random Read/Write, Seamless Small-Log File Writing. Ideal Host für OS oder Middleware, Buyers in AI/IoT Fields adopting Rapidly für Mission-Critical Workloads.
Double-Barreled Solution: CoreAnalyzer2 + SSDWidget2.0
Als AIoT/IoT Ecosystems zunehmend komplex, schuf Apacer Double-Barreled Solution für Real-World SSD Behavior Capture/Analysis. CoreAnalyzer2 Evaluates Workload Characteristics – Continuous Data Volume, Random Access Patterns, Wear Metrics – Recommends Optimal SSD und suggeriert Firmware Customizations when Necessary. SSDWidget2.0 provides Remote Real-Time Health Monitoring – Customers Anticipate Drive End-of-Life, Mitigate Data Loss. Together Extend SSD Lifespans, Enhance Reliability Worldwide.
3D TLC NAND SSD & VLP SODIMM
New 3D TLC NAND SSD: Carefully Selected Chips, BiCS3 Wafers, 64-Layer Vertical Stacking, Over-Provisioning Technology. Designed für Demanding IoT: Automation, Transportation, Logistics, Medical Devices, Intelligent Manufacturing, Smart Cities. Operating -40 °C bis +85 °C, Available in Variety Form Factors: PCIe, 2,5″, M.2, mSATA, MO-297, CFast, CFexpress, SDM, uSSD, USB Drive.
Apacers VLP SODIMM Industrial Memory featurest ECC für Data Error Detection/Correction – Enhances Reliability. Konstruiert mit Industrial-Grade Wide-Temp ICs, Stable Across -40 °C bis +85 °C, Addresses Overheating Concerns in IPCs. < 7 cm Length, 1,8 cm Height – World's Smallest Industrial-Grade Memory Modules. Available DDR4 2133/2400/2666 MHz, 4 GB oder 8 GB – High Performance, Low Power, Low Latency.
Eingebettet
- ROHM präsentiert Cutting-Edge Power Management & Sensor Solutions auf Embedded World 2019
- Hyperstone zeigt Next-Gen SSD Controller & Health Monitoring auf Embedded World 2019
- Conrad stellt Unified Digital Platform auf Embedded World Nürnberg vor
- Avnet Silica zeigt Cutting-Edge KI, IoT und Connectivity Solutions auf Embedded World 2019
- Maxim Integrated zeigt Advanced Wearable Health, IoT und Security Solutions auf Embedded World
- TDK enthüllt Cutting-Edge Embedded Tech Innovationen auf Embedded World 2019
- Renesas zeigt Cutting-Edge Endpoint Intelligence auf Embedded World 2019
- GIGAIPC IoT Innovations Showcase auf Embedded World 2019
- Cervoz Titan Serie – 3D NAND SSDs für Industrial Edge Computing (2019)
- Cervoz Ultra-Dünne M.2 NVMe SSDs: High-Performance Storage für Industrial Edge Anwendungen