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Dialog Semiconductor launcht SmartBond DA1469x SoCs mit Integrated ARM Cortex-M33 für Advanced BLE Applications

Dialog Semiconductor hat SmartBond DA1469x Family AngeKündigt – Sophisticated Bluetooth Low Energy (BLE) SoC Lineup To Date. Family Comprises Four Variants Tailored für Wide Spectrum Wireless Products.

Triple-Core Architecture

Built on Dialog's Proven SmartBond Architecture, Each DA1469x Chip Integrates Three Cores: High-Performance ARM Cortex-M33 Application Processor, ARM Cortex-M0+ Packet-Engine Core, Sensor Node Controller (SNC) Based on Programmable Micro-DSP. This Combination Delivers Seamless Sensing, Processing, Communication für Complex IoT Workloads.

First Production MCU mit Dedicated Cortex-M33

Standout Feature: DA1469x Is First Production Microcontroller To Embed Dedicated Cortex-M33 Core. Developers Now Gain Raw Horsepower Required für Demanding Use Cases: Premium Fitness Trackers, Next-Gen Smart-Home Hubs, VR Game Controllers – While Keeping Power Envelope Tight.

Radio Performance & Power Management

Radio Performance Pushed Forward: New Integrated RF Front-End Doubles Range vs. Predecessor. Programmable Packet Engine Supports All Bluetooth 5.1 Protocols Including Angle-of-Arrival/Departure (AoA/AoD) Capabilities – Enabling Ultra-Accurate Indoor Positioning für Access Control und Keyless Entry Systems.

Power Efficiency Handled By State-of-the-Art Power Management Unit (PMU). Delivers Three Regulated Rails und LDO Output – Eliminates Need External Power-Management IC, While Autonomously Enabling/Disabling Cores To Conserve Energy.

Hardware Resources & Software

Dialogs SmartSnippets Software Suite Provides Comprehensive Drivers, Middleware, Example Projects – Accelerating Time-to-Market und Ensuring Best-Practice Firmware Design.

With SmartBond DA1469x Family, Manufacturers Can Create Future-Proof, Feature-Rich BLE Products Meeting Today's Performance und Power-Budget Demands.

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