congatec introduces SMARC 2.0 Module mit NXP i.MX 8M Mini Prozessor
congatec announces a new SMARC 2.0 computer-on-module featuring the NXP i.MX 8M Mini processor. Leveraging a 14 nm FinFET design, the conga-SMX8-Mini delivers peak performance while consuming a fraction of the power of previous generations. It supports full-HD 3D graphics and high-definition video decoding/encoding, all within a thermally efficient, low-cost package.
Target Markets
Designed for mature industrial arenas—industrial and medical HMIs, kiosks, vending machines, infotainment systems—this platform also unlocks emerging markets such as situational-awareness solutions, machine-learning inference, voice-controlled and video-enabled residential gateways. With an operating temperature span of –40 °C to 85 °C and a projected 15-year field life, the modules are engineered for harsh environments. Hardware-accelerated MIPI-CSI-2 camera interfaces empower smart vision applications.
Ecosystem und Evaluation
The SoM is a ready-to-deploy subsystem backed by a robust ecosystem: pre-qualified bootloaders, Linux, Yocto, and Android BSPs, plus fully featured evaluation carrier boards. congatec's integration assistance and a portfolio of customizable technical services simplify deployment for OEMs and system integrators.
Engineers can evaluate the new SoM on evaluation boards during the forthcoming NXP Technology Days. These one-day events combine workshops, technical sessions, and a tailor-made agenda across venues in Barcelona, Bilbao, Madrid, Milan, Paris, and Boston. Register through the NXP Technology Days website.
Varianten und Specs
For ultra-low-power and cost-sensitive applications, the line offers three variants—quad, dual, and single-core ARM Cortex-A53 and Cortex-M4 based NXP i.MX 8M Mini processors—all rated for the extended/industrial temperature range. The on-chip GC NanoUltra 3D GPU supports 1080p H.265, H.264, VP8/9 decoding and H.264, VP8 encoding, enabling a single embedded display via dual-channel LVDS, eDP, or MIPI-DSI. Memory options include up to 4 GB LPDDR4 and 128 GB eMMC 5.1. Cameras connect through MIPI-CSI-2, complemented by 5× USB 2.0, 3× UART, 1 Gb Ethernet, and optional M2 Wi-Fi/Bluetooth.
Eingebettet
- Mouser führt Texas Instruments TPSM846C24: 35 A Fixed-Frequency Step-Down Power Modul mit Überstromschutz
- Intel stellt 10nm Agilex FPGA-Familie für datenzentrierte Anwendungen vor
- Apacer XR-DIMM: DO-160G zertifiziertes rugged DDR4 Memory für Defense und Aviation
- VadaTech stellt VTX350 vor: Robustes 6U VPX-Chassis mit High-Density Fiber Optic I/O
- PicoCoreMX8MM: Ultra-kompaktes ARM Modul powered by NXP i.MX 8M Mini
- VadaTech AMC741: 72-Core Tilera GX72 für Ultra-High-Performance Networking
- Lanner NCA-4020: High-Performance, Virtualization-Optimized Multi-Core uCPE Lösung
- VadaTechs FMC258: 12-Kanal FPGA Mezzanine (VITA 57.4, FMC+) mit MTP/MPO Faser, Ultra-Low Jitter Clocks, Full-Duplex Transceivern
- Axiomtek bringt SDM500L: Intel Smart Display Module Large mit 8. Gen Core & vPro
- Congatec stellt 8. Gen Intel Core Embedded Boards mit 15-Jahres-Verfügbarkeit vor